november 2011 doc id 018927 rev 1 1/7 7 STPS2L60-Y automotive power schottky rectifier features aec-q101 qualified negligible switching losses low forward voltage drop surface mount miniature package avalanche capability specified ecopack ? 2 compliant component description this power schottky rectifie r is suited to switched mode power supplies and high frequency dc to dc converters for automative applications. packaged in sma, this device is especially intended for use in low voltage, high frequency inverters and small battery chargers. table 1. device summary symbol value i f(av) 2 a v rrm 60 v t j (max) 150 c v f (max) 0.55 v k a sma stps2l60ay www.st.com
characteristics STPS2L60-Y 2/7 doc id 018927 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.43 x i f(av) + 0.06 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms voltage 10 a i f(av) average forward current t l = 115 c = 0.5 2 a i fsm surge non repetitive forward current t p =10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 1600 w t stg storage temperature range -65 to +150 c t j operating junction temperature range (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink -40 to +150 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol test conditions value unit r th(j-l) junction-lead 25 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 100 a t j = 100 c 2 10 ma v f (1) forward voltage drop t j = 25 c i f = 2 a 0.60 v t j = 125 c 0.51 0.55 t j = 25 c i f = 4 a 0.77 t j = 125 c 0.62 0.67 dptot dtj < 1 rth(j-a)
STPS2L60-Y characteristics doc id 018927 rev 1 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 i (a) f(av) = 1 = 0.5 = 0.2 = 0.1 = 0.05 t =tp/t tp i (a) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 t (c) amb t =tp/t tp r =100c/w th(j-a) r=r th(j-a) th(j-i) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to ambient versus pulse duration i (a) m 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c a t =125c a t =75c a 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse z/r th(j-l) th(j-l) t (s) p epoxy printed circuit board fr4, copper thickness: 35 m
characteristics STPS2L60-Y 4/7 doc id 018927 rev 1 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) i (a) r 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 0 102030405060 v (v) r t =125c j t =150c j t =100c j t =75c j t =50c j t =25c j c(pf) 10 100 1000 110100 f=1mhz v =30mv t =25c osc j v (v) r figure 9. forward voltage drop versus forward current (maximum values, low level) figure 10. thermal resistance junction to ambient versus copper surface under each lead i (a) fm 0 1 2 3 4 5 6 7 8 9 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 v (v) fm t =25c (maximum values) j t =125c (maximum values) j t =125c (typical values) j r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s(cu)(cm2) epoxy printed circuit board fr4, copper thickness: 35 m
STPS2L60-Y package information doc id 018927 rev 1 5/7 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint, dimensions in mm (inches) table 5. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055)
ordering information STPS2L60-Y 6/7 doc id 018927 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package we ight base qty delivery mode stps2l60ay s26y sma 0.068 g 5000 tape and reel table 7. document revision history date revision changes 02-nov-2011 1 initial release.
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